1.柔性芯片制造关键技术

研究柔性芯片制造过程中微损伤与裂纹扩展理论以及芯片失效机制，建立芯片性能预测模型，为柔性芯片高通量制造提供技术支撑；

2.微纳米器件能量耗散机理

研究在超高频率工作条件下微纳米谐振器中潜在的各种能量耗散机制（包括由于热传导、弹性波以及量子效应等造成的能量损耗），建立准确的定量分析模型，为微纳米谐振器的优化设计与性能提高提供理论依据和参考；

3.智能复合材料结构

集合复合材料结构设计和制造、力学、人工智能、微电子等多学科，多层级实现力学高性能化和多功能化的智能复合系统。

1.陈思宇#, 刘亚风#, 付从艺, 王海瑞, 陈颖, 陆炳卫, 马寅佶, 王禾翎, 冯雪*. 基于柔性传感技术的高速列车轮轨力在线监测方法. 中国科学：技术科学. 2023.

2.Ma, C.Z., Wei, A.R., Shi, K.W., Zhao, Y.M., Yang, W.D., Chen, S.Y.*, Guo, F.L.*. The role of axial pre-tension in reducing energy dissipation of micro/nano-mechanical resonators. European Journal of Mechanics / A Solids. 2023, 99: 104948.

3.Sha, W.H., Dai, X., Chen, S.Y., Yin, B.L., Guo, F.L.*. Phonon thermal transport in two-dimensional PbTe monolayers via extensive molecular dynamics simulations with a neuroevolution potential. Materials Today Physics. 2023.

4.Sha, W.H., Dai, X., Chen, S.Y., Guo, F.L.*. Phonon thermal transport in graphene/h-BN superlattice monolayers. Diamond and Related Materials. 2022, 129(10): 109341.

5.Wang, H.R., Zhang, Y., Chen, S.Y., Ma, Y.J., Wang, H.L.,Chen, Y.*, Feng, X.. Mechanics design of conical spiral structure for flexible coilable antenna array. International Journal of Aerospace Engineering. 2022, 4265384.

6.Wang, G., Ying, Y.Y., Chen, S.Y., Fu, J., Dong, W., Yang, A.M., Ma, Y.J., Feng, X.*. Flexible dual-channel digital auscultation patch with active noise reduction for bowel sounds monitoring and application. IEEE Journal of Biomedical and Health Informatics. 2022, 26(7): 2951-2962.

7.Chen, S.Y., Lyu, W.H., Wang, G., Chen, Y., Ma, Y.J.*, Feng, X.*. Mechanics analysis of ultra-thin chip peeling from substrate under multi-needle-ejecting and vacuum-absorbing. International Journal of Solids and Structures. 2021, 224: 111009.

8.Lyu, W.H., Ma, Y.J., Chen, S.Y., Li, H.B., Wang, P., Wang, F.L., Chen, Y., Feng, X.*. Flexible ultrasonic patch for accelerating chronic wound healing. Advanced Healthcare Materials. 2021, 2100785.

9.Ma, C.Z., Chen, S.Y., Guo, F.L.*. Simultaneous determination of the mass and position of attached particles using a micro-beam resonator-based mass sensor with axial pre-tension. Acta Mechanica. 2021, 232: 4037-4055.

10.Ma, Y.J., Li, H.B., Chen, S.Y., Liu, Y.F., Meng, Y.F., Cheng, J.H. and Feng, X.*. Skin-like electronics for perception and interaction: materials, structural designs and applications. Advanced Intelligent Systems. 2020, 2000108.

11.Chen, S.Y., Yang, W.D., Song, J., Guo. F.L.*. A new mechanism of energy dissipation in nanomechanical resonators due to the Casimir force. Journal of Applied Physics. 2019, 126: 044502.

12.Chen, S.Y., Song, J., Guo, F.L.*. Evaluation of thermoelastic damping in micromechanical resonators with axial pretension: An analytical model accounting for two-dimensional thermal conduction. Journal of Thermal Stresses. 2019, 42(9): 1192-1205.

13.Chen, S.Y., Niu, X., and Guo, F.L.*. Thermoelastic damping in micromechanical resonators operating as mass sensors, European Journal of Mechanics A/Solids. 2018, 71:165-178.

14.Chen, S.Y., Liu, J.Z., Guo, F.L.*. Evaluation of support loss in micro-beam resonators: A revisit. Journal of Sound and Vibration. 2017, 411: 148-164.

15.Yu, K., Hu, H.*, Chen, S.Y., Belouettar, S., Potier-Ferry, M.. Multi-scale techniques to analyze instabilities in sandwich structures. Composite Structure. 2013, 96(2):751-762.